EMMC EMCP UFS BGA 153 162 169 186 221 254 Universal Maintenance Platform Planting Tin Net Suit Chip Repair tools

  • $22.00


DIY Supplies: Metalworking
Application: Computer Tool Kit
Model Number: EMMC EMCP UFS BGA 153 162 169 186 221 254
Package: Case
Size: 10*10*3
Brand Name: wozniak
Type: BGA plant tin
Range of use: EMMC/EMCP/UFS Platform for
BGA Model: BGA162/169/186/221/254
Magnetic base: Precision positioning plat
Mobile phone Maintenance: Professional mobile phone repair kit
Multi-function product: High quality stee
Operating Temperature: suitable for BGA153 A89 reballing cell
Dissipation Power: Good
Application: Mobile Phone eMMC eMCP BGA153
Model Number: BGA reballing Stencil BGA153 189
USE: BGA reballing Stencil BGA153 162 189


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